Research on the Application of Endless Diamond Wire Saw

Overview:

With the continuous development of science and technology, non-metallic hard and brittle materials such as silicon, sapphire, engineering ceramics, optical glass, and gemstones are being increasingly used in space technology, mechanical industry, petrochemical industry, construction, and other fields. The requirements for the size and shape accuracy of parts manufactured from these materials are also increasing. The emergence of endless diamond wire saws meets these requirements and enables high-precision cutting.

Advantages of Diamond Wire Saw Cutting:

Cutting is a process in material processing, and many new cutting tools have emerged at different times. The rise of diamond wire saw cutting technology has greatly promoted the development of productivity, especially in the silicon crystal processing industry. Compared to laser cutting and waterjet cutting, diamond wire saw cutting has the advantage of cold processing. Compared to diamond band saws and disc saws, it has the advantages of narrower cutting seams and more material savings. In addition, the endless diamond wire saw has a higher cutting speed compared to conventional wire saws, providing irreplaceable advantages. Currently, the application of endless diamond wire saws is relatively limited. This article introduces its application prospects and focuses on experimental research in various cutting fields. All cutting fields mentioned in this article have been tested by Ensolltools. If you have product requirements, please feel free to contact us.

Applications of Endless Diamond Wire Saw Cutting:

Silicon Material Cutting:

Currently, diamond multi-wire saws are being used in the field of slicing single crystal silicon. Using 0.14mm diamond wires, single crystal silicon can be cut with a surface roughness of Ra~0.3um, showing obvious line marks on the surface.

When cutting larger-sized (420) single crystal silicon rods with diamond band saws, the surface is uneven with large ripples. When cutting with a single diamond wire, small ripples are formed on the cutting surface due to the reciprocating motion of the diamond wire, resulting in higher roughness.

Endless diamond wire saws can achieve high-speed cutting of silicon materials without producing wave patterns, resulting in lower surface roughness. In order to further understand the cutting of silicon crystals using endless diamond wire saws, we conducted cutting experiments and analyzed the influence of cutting parameters on the surface quality of silicon wafers.

The data shows that endless diamond wire saws perform well in cutting polycrystalline silicon wafers, with a minimum roughness of Ra between 0.328-0.6um and a total thickness deviation of about 10um. It also has high cutting efficiency. Endless diamond wire saws have wide applications in the field of silicon materials, such as truncating larger-sized (diameter 420mm) single crystal silicon rods, cutting heads and tails, and squaring. Using endless diamond wire saws, the cutting operation of silicon ingots (830mm×830mm×250mm) can be completed within two hours.

Precious Wood Cutting:

Precious woods such as rosewood and Huanghuali are becoming increasingly rare and valuable. When cutting and processing, narrower saw seams are required. Additionally, curved cutting is often needed according to the wood processing requirements.

Endless diamond wire saws meet the requirements of cutting precious woods with narrow seams. During cutting, the feed speed is 20-40mm/min, resulting in a smooth and flat surface with roughness Ra < 1um, significantly reducing the need for grinding and polishing processes.

The circular shape of the wire saw allows for easy turning at any angle, and our latest development of special-shaped cutting equipment can meet the requirements of cutting at any angle.

Gemstone Cutting:

In the gemstone industry, saw blades are commonly used for cutting, resulting in wider seams and significant waste. It is also difficult to achieve curved surface processing. Using endless diamond wire saws, the saw seams for cutting gemstones are only a few tenths of a millimeter, with high cutting efficiency and a smooth cutting surface. It is particularly suitable for cutting more valuable gemstones.

Endless diamond wire saws can achieve curved surface cutting and process circular and various irregular patterns on gemstones.

Endless diamond wire saws can cut large-sized stones with widths ranging from 500-1000mm. For example, for marble murals with a width of 1m and a thickness of about 10mm, which are prone to cleavage, cutting with saw blades or band saws results in wider seams and uneven surfaces, causing higher cutting stress and easy damage. Endless diamond wire saws have low cutting stress and can cut thin slices of 500mm×250mm×1mm without breaking, with surface roughness (Ra 0.7um) lower than saw blade cutting, reducing the subsequent processing strength.

Conclusion:

This article introduces the performance, characteristics, and application fields of endless diamond wire saws. The wire saws produced by our factory have a minimum diameter of 0.3mm and can be customized according to customer requirements. They have been widely used in the cutting of silicon materials, precious woods, and gemstones. The application of endless diamond wire saws has greatly improved cutting efficiency, reduced material waste, and achieved high-precision cutting. With the continuous development of technology, endless diamond wire saws are expected to have broader applications in various fields.

Our factory（https://www.toolsresearch.com/） can provide free trial cutting services, and we can cut all the materials mentioned above. We can also cut many other different categories. If you have any needs, please feel free to send us the materials for trial cutting.