ESD150-3T Diamond Wire Saw Cutting Machine

The Diamond Wire Loop Tabletop Cutting Equipment is a high-precision cutting tool specifically designed for laboratories, research institutions, and small-scale processing workshops. Utilizing diamond wire cutting technology, it is suitable for precision cutting of various hard and brittle materials. Characterized by high precision, efficiency, and user-friendly operation, it is an ideal choice for scientific research and small-scale production.

Product Advantages
1.High-Precision Cutting

The cutting precision reaches ±0.05mm, with a surface roughness as low as Ra 0.5μm, meeting the demands of high-precision processing.

Suitable for cutting ultra-thin materials, with a minimum cutting thickness of 0.1mm.

2.Multi-Functional Applicability

Capable of cutting various hard and brittle materials, including silicon wafers, sapphire, ceramics, glass, stone, composite materials, and more.

Wide cutting thickness range, from 0.1mm to 50mm, catering to different material requirements.

3.High-Efficiency Cutting Speed

The cutting speed can reach up to 20mm²/min, significantly improving experimental and production efficiency.

Automated cutting mode reduces manual intervention and enhances consistency.

4.Compact Desktop Design

The equipment features a small footprint, occupying only 0.5㎡, making it ideal for laboratories and small workshops.

The user-friendly interface supports one-click operation, ensuring ease of use.

5.Low Consumable Costs

The diamond wire has a long service life, with a single wire capable of cutting over 1000 meters of material, reducing consumable costs.

The equipment is easy to maintain and has low operating costs.