Silicon Cropping with Diamond Wire Saw
Video Cutting Details
Cutting Tools:Diamond Wire Loop
|Wire Type||Multi strand wire|
Cutting Material :Monocrystalline silicon
Feed Speed:30 mm/min
Cooling Way: wet
Surface: Cutting surface is very smooth ,clean, flat and without saw mark
Kerf: Cutting kerf is straight ,narrow and smooth
Time:Cutting speed rises around 3 time compare to traditional cutting saw,the whole cutting process last 7 minites.
1,Minimal Kerf Loss
The closed wire loop have a 0.5MM diameter ,the kerf loss is 0.55 MM.Which saves a lot material .
Ensoll diamond wire use patent tech to coat diamond abrasive to the core wire , total thickness variation is small and almost no bow and warp. By this way, cutting quality can be highly improved.
One worker can operate 5 to 7 machines
With high stability and reduced wire breakages and loss of diamond grains. There is no need to change wire all the time and the machine is very easy to operate.
1/3 machine cost!
3 times cutting efficiency!
Longer wire durability !
One loop can cut more than 200 times
Traditionally silicon cutting machine and tool are very expensive, inefficient, and often times unreliable.
Slurry saws are more capable than band saw blades, but they have issues of polution. Slurry processes can be very time consuming and also produce very much unusable waste.
Fixed diamond wire loop is commonly used for Si cropping . Loop diamond wire is developed to rise silicon cutting efficiency to another level.
For silicon cutting ,there are alternative wire length to be chosen, L 2670mm, L2640, L2960, L4430 are the most widely used length and other wire length can be customized.
What We Cut:
Not only all types of silicon but also all kinds of expensive hard and brittle materials .