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Diamond Wire Loop -D0.6

Cutting silicon materials with Ensoll diamond wire loop under high speed ,could gain better surface finish and great cutting efficiency.

For silicon cutting, the surface finish is among 0.328-0.6μm,  total thickness variation is about 10μm..

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Diamond Wire Loop -D0.6


Diamond loop wire saw Model D0.6 and D0.65 is our standard model. It is a smart choice for  precision cutting.

This diameter contains both precision and durability.

It can cut almost all materials .For example, sapphire ,marble ,silicon,crystal,ceramic ,graphite,wafer,hollow brick ,foam cement ,foam alumina and so on.

diamond saw

Advantages :

  • High cutting efficiency
  • Narrow kerf width
  • Better cutting quality
  • longer wire life span


Products Properties:


D0.6 Loop Diamond wire is mainly used for cutting hard and brittle materials: stone, sapphire, monocrystalline and polycrystalline silicon,silicium chip etc.

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