The uses of circular diamond wire cutting

Diamond wire is a type of wire saw where diamonds are electroplated onto the wire or otherwise bonded, utilizing the hardness of diamonds to cut hard and brittle materials such as silicon wafers and jade.

The diamond wire industry is primarily used for cutting hard and brittle materials such as photovoltaic silicon wafers, sapphires, and jade. It is an industry encouraged and supported in the national industrial restructuring. In addition to its main applications in sapphire and crystalline silicon wafer cutting, in recent years, with the continuous innovation and development of new material applications, the types and scope of diamond wire cutting applications have also been expanding. Circular diamond wire, now serving as a new type of cutting equipment, has become an indispensable cutting method in the material cutting market. Compared to traditional wire cutting methods, circular diamond wire possesses various significant advantages.

Circular diamond wire cutting, unlike traditional reciprocating diamond wire cutting, enables high-speed cutting. The cutting speed can be increased to more than twice the original speed, reducing time consumption significantly and saving a considerable amount of time. Moreover, circular diamond wire cutting offers high precision. The cutting accuracy of circular diamond wire is relatively high, making it the preferred cutting technology for precious materials such as sapphires and jade. Additionally, diamond wires are available in various diameters, allowing customers to choose different diameters based on their requirements, thus meeting a variety of customer needs.