Experience Precision Cutting Live – Last Chance at Shenzhen Optoelectronics Expo!
Today is your final opportunity to join us at the Shenzhen International Optoelectronic Exposition and witness the ESO-GM Diamond Wire Saw Cutting Machine in action. This high-performance cutting system delivers unmatched precision for processing hard and brittle materials including silicon carbide, sapphire, optical glass, advanced ceramics, and composite substrates.
At our booth you can:
Observe live demonstrations showcasing smooth, burr-free cutting capabilities
Explore how its low kerf loss and high TTV accuracy optimize material yield
Receive technical guidance tailored to your industry application
Ideal for semiconductor manufacturing, photonics R&D, and new energy materials processing—this is your last chance to see the ESO-GM revolutionize precision cutting!
📍 Booth: Hall 3, D12
🕙 Today’s Demo Sessions: 10:30 AM, 1:30 PM, 3:30 PM
Connect with our engineers to discuss how the ESO-GM can elevate your production line or research project. We look forward to meeting you!
