We made cutting test for glass,this is a glass block with in widely used in construction industry, it’s very hard and brittle,we used 0.5 MM diameter wire loop as cutting tool,the whloe cutting are wet cutting with water .
you can contact us for more info
Diamond wire loop cutting machine What is diamond wire loop saw? The diamond wire loop is a flexible cutting tool that consolidates diamond on the annular steel wire substrate. It moves in one direction during cutting, and the cutting line speed is 40-60 m/s. The diamond... read more
A New Way to Cut Cat Scrather With the improvement of people’s living standards, more and more people have started to keep pets, and the pet products market has also begun to flourish. Cat scratchers are a favorite toy for cats, and every cat owner will... read more
What is aluminum foam Brief introduction of aluminum foam Aluminum foam is made by adding additives to pure aluminum or aluminum alloy, and it is made by foaming process, and it has the characteristics of metal and bubbles at the same time. It has both the... read more
Diamond VS Traditional Wire Cutter What is in your mind when you heard wire cutter? or Yes, It is a tool to cut wire like items in the past, but from just years ago, it becomes a tool to cut whatever... read more
How Silicon Solar industry make the extremely thin wafer Wafering is the process by which a silicon crystal is made into wafers. This process is usually carried out by a multi wire saw which cuts multiple wafers from the same crystal at the same time. These wafers are then polished to... read more
What is sapphire Sapphire is a precious gemstone, a variety of the mineral corundum, consisting of aluminium oxide (α-Al2O3) with trace amounts of elements such as iron, titanium, chromium, vanadium, or magnesium.The name sapphire is derived from the Latin “saphirus” and the Greek “sapheiros”, both... read more
Glass Cutting Technology Innovation – Continuous Diamond Wire Saw Glass, as a... read more
Classification of semiconductor silicon wafers according to different parameters Semiconductor Silicon Wafer is the basis for manufacturing silicon semiconductor products and can be classified according to different parameters. According to different sizes (diameters), semiconductor silicon wafers can be divided into 2 inches (50mm), 3 inches (75mm),... read more
Cutting Ceramic Cup with Diamond Wire Sawing Machine. Ensoll have assembled a diamond wire saw in our office. We are going to do a lot cutting test here, to explore the features of diamond wire loop and diamond wire sawing machine. As a trial test, we... read more
What is the best Marble cutting machine? Marble cutting machine is difficult to choose ,because marble is too brittle to cut .there are some factories who provide marble cutting service . How they do the marble cutting and polishing?what kind of marble cutting saw do they... read more
© CopyRight by Ensoll .
