Si Ingot lõikamismasina revolutsioon
With the rapid development of the semiconductor industry, nõudlus ränikiipide järele kasvab, samuti suureneb räni valuplokkide töötlemismaht. Räni valuploki lõiketehnoloogiat on läbi viidud palju täiustusi.
Ülemise ja saba lõikamise protsessis, traditsiooniline viis on lõigata lintsaega.
Kuid, lintsael on suur lõiketer, which is prone to cause silicon edge break and the quality of the cut surface is bad too.
This makes the silicon material loss is very high during cutting process.
With the successful development of diamond endless wire, new endless wire cutting technology has gradually replaced the position of diamond band saw in silicon rod processing.
The linear speed of circular wire cutting is up to 60 Prl, the cutting speed is very fast, and because of the flexible cutting method of wire cutting, the cutting effect is very good.in the same time the silicon rod is rarely damaged.
The diameter of the closed diamond wire is about 0.4-0.6 MM, and the cutting kerf is about 0.5-0.7 MM, which greatly reduces the loss of silicon. This is very valuable in today’s society where silicon materials are expensive, and it is loved by many photovoltaic and semiconductor industries.
Ensoll Tool’s endless diamond wire and supporting equipment have rich experience in silicon processing. Its silicon ingot cutting machine is small in size and easy to operate. It can be regarded as a huge improvement of silicon rod cutting equipment.
This is a video of a circular wire device cutting silicon rods.
https://www.youtube.com/watch?v=N_Y8G8xaMSo
Feel free to võta meiega ühendust to learn more.
